Lauffer GmbH＆Co. KG（Lauffer Pressen）开发新一代自动层压系统
Automatic Lamination Technologies and Lauffer Pressen enter
cooperation for dry film and dry film solder mask lamination
Italian based Automatic Lamination Technologies Srl. (Dynachem) and German
Maschinenfabrik Lauffer GmbH & Co. KG (Lauffer Pressen) have entered a close
cooperation with respect to the development and production of a new generation of
automated lamination system for laminating dry film and dry film solder mask on
flexible and rigid PCBs, LEDs, ABFs, IC substrates and semiconductors.
The new generation of systems will include proven Dynachem equipment modules
such as pre-tack laminators and modular vacuum chambers as well as electrically
heated, flat bed lamination presses from Lauffer. The system is designed to ensure
the elimination of trapped air bubbles from the product surfaces and provide perfect
encapsulation. The modular system will be operated with roll-to-roll conveyors.
Given its design, the new machine is able to process single and double sided
products in order to achieve high lamination quality and excellent conformation to fine
patterns with dry film photoresist, dry film solder mask, dielectric film, copper foil for
SBU technology and many other film layup applications. The integration of the new
Lauffer flat press module ensures a good surface flatness and adhesion of the
We expect this collaboration to be fruitful in addressing our customer needs and
together with our new vacuum chamber, this new line developed with Lauffer will
greatly expand our product offering to the existing customer bases of both
companies and new customers, says Osvaldo Novello, Managing Director at
Automatic Lamination Technologies.